The bond pad redistribution layer (polyimide 1) and the under bump
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WO2018237377A1 - Curable polyimides - Google Patents
Redistribution Layers (RDLs) - Semiconductor Engineering
PDF) Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterization
More than Moore through Advanced Semiconductor Packaging
Chip Scale Packaging Helps Portable Medical Devices Save Size and Weight
Polymers, Free Full-Text
Wafer level packaging having bump-on-polymer structure - ScienceDirect
Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging
Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM - ScienceDirect
Illustration of polyimide or LCP substrate and solder assembly approach.
